Titanium Sublimation Pump (TSP)
TITANIUM SUBLIMA TION PUMPING (TSP )
Titanium Sublimation Pumps (TSPs) are often used in combination with ion pumps or independently to remove reactive gases from the vacuum environment. Combined with an ion pump, the TSP allows for low ultimate pressures in a shorter amount of time. All TSP components are bakeable to 400˚C.
TSP filament cartridge
The filament cartridge is mounted on a 2- 3/4” CFF (NW 35). The feedthrough supports three titanium-molybdenum filaments and a return path for ground isolation. Each filament contains 1.5 grams of usable titanium and averages 20 hours of operation.
Liquid cryoshroud
The liquid cryoshroud consists of a double walled, type 304L stainless steel cylinder with two liquid nitrogen feedthroughs (.375 in. diameter) with flare type fittings. It provides 1578 cm2 (245 in.2) of liquid nitrogen cooled surface area that provides pumping speeds up to 12,000 l/s for hydrogen (see table). The shroud is mounted on an 8 in. CFF (NW 150).
Ambient Sputter Shield
The ambient sputter shield economically maximizes surface area when cooling is not practical or possible. It provides 827cm2 (128 in. 2) of ambient temperature surface area that provides pumping speeds up to 2200 l/s for hydrogen (see table). The shield is mounted on an 8 in. CFF (NW 150) or a 6 in. CFF (NW 100).
DIGI TEL ™ TSP /NEG controller
The TSP/NEG controller has an easy-to-read touchscreen LCD display that displays all manual or programmed firing paramenters. Manual operation is as simple as pressing one button. Programming is just as easy by viewing all programming options on one screen. The TSP/NEG controller can operate up to 8 TSP filaments or 2 NEG pumps.
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